PC8007 Low Viscosity Glob Top Encapsulant
In stock
Ships on dry ice (+$45.00 to S&H).
PC8007 is a high performance epoxy for encapsulation applications. The product is suited for bonding and sealing uses requiring high modulus and temperature resistance.
Product Features:
- High Thermal Resistance
- Rigid and High Strength
- Durable
- Low Viscosity
Shipping Requirements:
Dry Ice
Tg:
160°C
Density:
1.72
Viscosity:
4,000 cP @ 25°C
CTE (ppm):
< 20 ppm
Polymer Type:
epoxy
Cure Time/ Temp (hrs/°C):
60 minutes @ 100°C + 60 minutes @ 165°C
Glass Transition Temperature, Tg (ºC):
160°C
