Coatings
Coatings
Conformal
| Cat. # | Description | Viscosity (kCps) | Cure Time/ Temp (hrs/°C) | Tg (°C) | CTE (ppm) | Modulus (MPa) | Durometer | Thermal Conductivity (W/m•K) |
|---|---|---|---|---|---|---|---|---|
| CC1002 |
Epoxy based coating & sealant with high heat resistance, chemical resistance, excellent adhesion & durability. Low viscosity, high gloss & curable by heat. |
0.4 | 1/150 | 70 | 2500 | 85D | N/A | |
| CC1003 |
Epoxy based coating & sealant with high heat resistance, chemical resistance, excellent adhesion & durability. Low viscosity, high gloss & curable by heat. |
0.6 | 1/150 | 70 | 2500 | 85D | N/A | |
| CC1004 |
Epoxy based coating & sealant with high heat resistance, chemical resistance, excellent adhesion & durability. Low viscosity, high gloss & curable by heat. |
2 | 1/150 | 70 | 2500 | 85D | N/A | |
| CC1200 |
Fast UV curing, no mix coating with good adhesion, no volatile emissions, a wide temperature use range, & fluorescence. Curable by UV or UV & heat. |
1.5 | UV or UV + 0.5/120 | 100 | 25 | 65D | N/A |
Wafer Level
| Cat. # | Description | Viscosity (kCps) | Cure Time/ Temp (hrs/°C) | Tg (°C) | CTE (ppm) | Modulus (MPa) | Durometer | Thermal Conductivity (W/m•K) |
|---|---|---|---|---|---|---|---|---|
| WL2000 |
Epoxy based protective &/or negative photoresist coating suited for applications at the wafer level. Excellent adhesion, good chemical resistance, low viscosity, high gloss, & UV &/or heat curable. Applied by brush, dip, spin coat, or spray methods. |
0.1 | 1/150 | 70 | 2500 | 85D | N/A | |
| WL2010 |
Epoxy based, protective &/or negative photoresist coating suited for applications at the wafer level. Excellent adhesion, good chemical resistance, low viscosity, high gloss, & UV &/or heat curable. Applied by brush, dip, spin coat, or spray methods. |
0.1 | 1/150 | 70 | 2500 | 85D | N/A | |
| WL4000 |
Epoxy based negative photoresist coating suited for applications at the wafer level. |
0.1 | UV 600-900 mJ + 1/150 | <30 | 3000 | 85D | N/A |