Conformal Coatings

An epoxy based conformal coating. The product has been designed for coating and sealing of electronic components requiring high heat resistance and durability. The product has excellent adhesion, chemical resistance and is easy to process.

Non-conductive epoxy designed for die attach bonding. Good durability, good adhesion, & low cure stress on sensitive devices. Thermally curable.

High performance epoxy for encapsulation applications. Well suited for many bonding & sealing uses requiring high modulus & high temperature resistance. Thermally curable.

Rapid curing capillary flow underfill with low stress cure, high durability, high Tg, & low CTE. Thermally curable.

Epoxy based protective &/or negative photoresist coating suited for applications at the wafer level. Excellent adhesion, good chemical resistance, low viscosity, high gloss, & UV &/or heat curable. Applied by brush, dip, spin coat, or spray methods.

Epoxy based, protective &/or negative photoresist coating suited for applications at the wafer level. Excellent adhesion, good chemical resistance, low viscosity, high gloss, & UV &/or heat curable. Applied by brush, dip, spin coat, or spray methods.