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EW8002 NoSWEEP™ Wire Bond Encapsulant

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Catalog No. Packaging Size Price Quantity
EW8002 10cc
€0.00

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Description

100% solid, silica filled liquid encapsulant designed for quick self-leveling in large dam & fill or glob top applications, & encapsulation of narrow diameter, long, & ultra fine pitch wire bonds on semiconductor devices. Low modulus & CTE, excellent adhesion to inorganic & organic substrates, thermally curable, & non-sweeping. Available in dam & fill or glob top versions.

Tg:
150ºC
Viscosity:
50
Appearance:
Black Liquid

MSDS / Technical Data Sheets / Product Literature

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