UV & Thermally Curable

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UV & Thermally Curable

Cat. # Description Viscosity (kCps) Cure Time/ Temp (hrs/°C) Tg (°C) CTE (ppm) Modulus (MPa) Durometer Thermal Conductivity (W/m•K)
WL2000

Epoxy based protective &/or negative photoresist coating suited for applications at the wafer level. Excellent adhesion, good chemical resistance, low viscosity, high gloss, & UV &/or heat curable. Applied by brush, dip, spin coat, or spray methods.

0.1 1/150 70 2500 85D N/A
WL2010

Epoxy based, protective &/or negative photoresist coating suited for applications at the wafer level. Excellent adhesion, good chemical resistance, low viscosity, high gloss, & UV &/or heat curable. Applied by brush, dip, spin coat, or spray methods.

0.1 1/150 70 2500 85D N/A
WL4000

Epoxy based negative photoresist coating suited for applications at the wafer level.
Rapidly curable by UV light, good adhesive properties.

0.1 UV 600-900 mJ + 1/150 <30 3000 85D N/A
CC1200

Fast UV curing, no mix coating with good adhesion, no volatile emissions, a wide temperature use range, & fluorescence. Curable by UV or UV & heat.

1.5 UV or UV + 0.5/120 100 25 65D N/A