SD54G0 EdgeCONTROL™
| Catalog Number | Unit Size | Price | QTY |
|---|---|---|---|
| SD54G0-30 | 30cc |
€0.00
|
|
€0.00
In stock
Low modulus retention dam specifically formulated to offer low cure stress & low warpage for liquid encapsulation of BGA & MCM packages. Good adhesion to various rigid and flexible organic & ceramic substrates, high viscosity, high thixotropy, & thermally curable. Designed to be used with LoSTRESSTM liquid encapsulant.
Application(s):
Dam
Shipping Requirements:
Dry Ice
Viscosity:
100
Molecular Weight:
<2000
Cure Type:
UV, Thermal
CTE (ppm):
130
Modulus (MPa):
1.5
Durometer:
85A
Thermal Conductivity (W/m•K):
N/A
Cure Time/ Temp (hrs/°C):
UV or 1/150
Glass Transition Temperature, Tg (ºC):
-20
Hazards:
Skin sensitizer
Handling:
Gloves & chemical goggles
