EW8002 NoSWEEP™ Wire Bond Encapsulant
| Catalog Number | Unit Size | Price | QTY |
|---|---|---|---|
| EW8002-10 | 10cc |
€0.00
|
|
€0.00
In stock
100% solid, silica filled liquid encapsulant designed for quick self-leveling in large dam & fill or glob top applications, & encapsulation of narrow diameter, long, & ultra fine pitch wire bonds on semiconductor devices. Low modulus & CTE, excellent adhesion to inorganic & organic substrates, thermally curable, & non-sweeping. Available in dam & fill or glob top versions.
Application(s):
Wire Bond, Glob Top, Fill, Potting Compound
Shipping Requirements:
Dry Ice
Tg:
150ºC
Viscosity:
50
Appearance:
Black Liquid
Cure Type:
Thermal
CTE (ppm):
15
Modulus (MPa):
3500
Durometer:
85D
Thermal Conductivity (W/m•K):
N/A
Polymer Type:
Epoxy
Cure Time/ Temp (hrs/°C):
1/100 + 1/165
Glass Transition Temperature, Tg (ºC):
150
