Products

PC570 Rapid Heat Curing Epoxy Adhesive/Encapsulant

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Catalog No. Packaging Size Price Quantity
PC570 1kg kit
€0.00

Inquire for availability.

Description

2 component epoxy designed for bonding, encapsulating, & sealing applications requiring high strength, high rigidity, & high Tg. Thermally curable.

Molecular Weight:
<1000
Viscosity:
1
Hazards:
Skin sensitizer
Handling:
Gloves & chemical goggles

MSDS / Technical Data Sheets / Product Literature