High Temperature

14 Item(s)

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  1. SD1010 EdgeCONTROL™

    SD1010 EdgeCONTROL™

    €0.00

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    100% solids liquid encapsulant designed for encapsulation & bonding applications requiring very high modulus & heat resistance. Thixotropic & well suited as a damming product for low viscosity encapsulants. Dimensional stability, low stress, rigid, durable, high Tg, & thermally curable. Designed to be used with NoSWEEPTM EW8000 series encapsulant.

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  2. SD1011 EdgeCONTROL™

    SD1011 EdgeCONTROL™

    €0.00

    Inquire for availability.

    100% solids liquid encapsulant designed for encapsulation & bonding applications requiring very high modulus & heat resistance. Thixotropic & well suited as a damming product for low viscosity encapsulants. Dimensional stability, low stress, rigid, durable, high Tg, & thermally curable.

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  3. PC570 Rapid Heat Curing Epoxy Adhesive/Encapsulant

    PC570 Rapid Heat Curing Epoxy Adhesive/Encapsulant

    €0.00

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    2 component epoxy designed for bonding, encapsulating, & sealing applications requiring high strength, high rigidity, & high Tg. Thermally curable.

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  4. PC600 A&B Potting Compound Liquid Encapsulant

    PC600 A&B Potting Compound Liquid Encapsulant

    €0.00

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    2 component epoxy designed for bonding, encapsulating, & sealing applications requiring high strength, high rigidity, & very high Tg. Rapid thermal curing.

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  5. PC1200 Epoxy Adhesive Kit

    PC1200 Epoxy Adhesive Kit

    €0.00

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    2 component epoxy encapsulant for applications requiring high thermal conductivity, heat resistance, rigidity, & dimensional stability. Excellent adhesion to many substrates including metals, themosetting plastics, & ceramics, good durability, high modulus, low CTE, & thermally curable.

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  6. PC410 A&B Potting Compound Liquid Encapsulant

    PC410 A&B Potting Compound Liquid Encapsulant

    €0.00

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    2 component, highly filled epoxy resin encapsulant designed for potting & encapsulation where high thermal conductivity is required. Excellent moisture resistance, low CTE, high strength, & room temperature or thermally curable.

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  7. PC420 A&B Thermally Conductive Epoxy

    PC420 A&B Thermally Conductive Epoxy

    €0.00

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    2 component, ceramic, non-metal filled, epoxy-based product designed for potting & encapsulation where high strength & thermal conductivity are required, particularly useful for the assembly of components requiring heat dissipation. Curable at room temperature or by heat.

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  8. Liquid Encapsulant HV400A&B

    Liquid Encapsulant HV400A&B

    €0.00

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    2 component, addition cured silicone encapsulant designed for applications that require low stress & excellent electrical properties. Designed for potting & encapsulation where low cost & low viscosity is required. Room temperature or thermally curable.

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  9. HV200A&B Silicone Elastomer

    HV200A&B Silicone Elastomer

    €0.00

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    2 component, high strength, silicone elastomer with many useful features including a wide service temperature range of use, good environmental stability, & good cured flexibility. Well suited for many sealing & bonding applications, transluscent, low modulus, & thermally curable.

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  10. Liquid Encapsulant HV300A&B

    Liquid Encapsulant HV300A&B

    €0.00

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    2 component, silicone encapsulant designed for applications requiring high thermal conductivity & stability. Rapidly cures with moderate heat & easy to use.

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  11. EW8003 NoSWEEP™ Wire Bond Encapsulant

    EW8003 NoSWEEP™ Wire Bond Encapsulant

    €0.00

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    Structural epoxy adhesive with high strength & durability. Particularly useful for demanding bonding applications requiring very high performance properties. Tough, impact resistant, good adhesion to many metals, ceramics, & thermosetting plastics. Thermally curable.

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  12. EW7072 NoSWEEP™ Wire Bond Encapsulant

    EW7072 NoSWEEP™ Wire Bond Encapsulant

    €0.00

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    100% solid, silica filled liquid encapsulent for encapsulation of narrow diameter, long, & ultra fine pitch wire bonds on semiconductor devices. Thermally curable & non-sweeping. Available in dam & fill or glob top versions.

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  13. PC7050 UV Curable Epoxya

    PC7050 UV Curable Epoxya

    Starting at: €0.00

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    UV curable epoxy product well suited for use in applications requiring high heat resistance, rigidity, & durability. Low viscosity, good adhesion, high modulus, high strength, & rapid cure.

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  14. SF850 A&B OptiCLEAR™ Liquid Encapsulant Fill

    SF850 A&B OptiCLEAR™ Liquid Encapsulant Fill

    Starting at: €0.00

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    2 component epoxy designed for encapsulating & coating applications requiring good clarity & high heat resistance. Excellent adhesion to many substrates including metals, glass, & ceramics.

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