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SD1010 EdgeCONTROL™

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Catalog No. Packaging Size Price Quantity
SD1010 30cc
€0.00

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Description

100% solids liquid encapsulant designed for encapsulation & bonding applications requiring very high modulus & heat resistance. Thixotropic & well suited as a damming product for low viscosity encapsulants. Dimensional stability, low stress, rigid, durable, high Tg, & thermally curable. Designed to be used with NoSWEEPTM EW8000 series encapsulant.

Tg:
165ºC
Viscosity:
1000
Appearance:
Black Paste

MSDS / Technical Data Sheets / Product Literature

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