Liquid Encapsulants - LoSTRESS

LoSTRESS Liquid Encapsulants are a new generation low modulus fill material specifically designed to offer low cure stress and low warpage.

These encapsulants are novel, epoxy-based 100% solids, single component liquid semiconductor encapsulants designed for devices requiring high toughness, flame retardancy and strong adhesion to various substrates such as metal, ceramic and organic. LoSTRESS is especially suitable for SAW filter applications.

LoSTRESS can virtually eliminate warp on ceramic substrates due to the low cure stress. Dam and fill and glob top versions are available.

Key Benefits:
• Very little warpage on HTC and LTCC substrates for easy downstream process
• Minimal cure stress on sensitive devices such as SAW filters
• High adhesion to die, substrates and most other interfacing materials

4 Item(s)

per page

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  1. SF54GB LoSTRESS™ Liquid Encapsulant

    SF54GB LoSTRESS™ Liquid Encapsulant

    €0.00

    Inquire for availability.

    Low modulus, green flame retardant fill material specifically designed to offer low cure stress & low warpage. 100% solids, epoxy based liquid encapsulant designed for encapsulation of semiconductor devices requiring improves aging resistance, high toughness, green flame retardancy, & strong adhesion to various substrates such as metal, ceramic, & organic. Thermally curable.

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  2. SF5002 LoSTRESS™ Liquid Encapsulant

    SF5002 LoSTRESS™ Liquid Encapsulant

    €0.00

    Inquire for availability.

    Low modulus, flame retardant fill material specifically designed to offer low cure stress & low warpage. 100% solids, epoxy based liquid encapsulant designed for encapsulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organic.

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  3. PC7010 UV Curable Encapsulant & Adhesive

    PC7010 UV Curable Encapsulant & Adhesive

    Starting at: €0.00

    Inquire for availability.

    Flowable, 100% solids, UV curable encapsulant & adhesive useful for potting & bonding applications which are subject to a wide temperature range of exposure.

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  4. SF5021 OptiCLEAR™ Liquid Encapsulant Fill

    SF5021 OptiCLEAR™ Liquid Encapsulant Fill

    Starting at: €63.00

    Low modulus fill material specifically designed to offer efficient light transmission & low cure stress. A 100% solids, unfilled, liquid encapsulant designed for encasulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organice. UV or thermally curable.

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