|Cat. #||Description||Viscosity (kCps)||Cure Time/ Temp (hrs/°C)||Tg (°C)||CTE (ppm)||Modulus (MPa)||Durometer||Thermal Conductivity (W/m•K)|
2 component clear silicone gel suitable for various applications. Inert, low modulus, low viscosity, clear, & thermally curable.
2 component, low viscosity silicone encapsulant suitable for encapsulation applications including sesnsitive optoelectronic assemblies. Stress free & thermally curable.
2 component, addition cured silicone encapsulant designed for applications that require low stress & excellent electrical properties. Designed for potting & encapsulation where low cost & low viscosity is required. Room temperature or thermally curable.
2 component, high strength, silicone elastomer with many useful features including a wide service temperature range of use, good environmental stability, & good cured flexibility. Well suited for many sealing & bonding applications, transluscent, low modulus, & thermally curable.
2 component, silicone encapsulant designed for applications requiring high thermal conductivity & stability. Rapidly cures with moderate heat & easy to use.