EdgeCONTROL™ Dams

EdgeCONTROL™ Dams

Designed to work with LoSTRESS™ and NoSWEEP™ fill encapsulants. Polyscience's EdgeCONTROL™ Dams offer low waprage while maintaining high viscosities and excellent electrical insulation.

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EdgeCONTROL Dams

Cat. # Description Viscosity (kCps) Cure Time/ Temp (hrs/°C) Tg (°C) CTE (ppm) Modulus (MPa) Durometer Thermal Conductivity (W/m•K)
PC7030

UV curable adhesive with excellent adhesion to a wide range of materials. Well suited for use in applications requiring bonding to hard to adhere substrates. Rigid, wide temperature use range, & cures in seconds.

1 UV 80 80 70D N/A
SD54G0

Low modulus retention dam specifically formulated to offer low cure stress & low warpage for liquid encapsulation of BGA & MCM packages. Good adhesion to various rigid and flexible organic & ceramic substrates, high viscosity, high thixotropy, & thermally curable. Designed to be used with LoSTRESSTM liquid encapsulant.

100 UV or 1/150 130 1.5 85A N/A
SD8001

A 100% solids, single component, silica filled, liquid epoxy system used for many applications. This material was designed as a retention dam for liquid encapsulation or as a Stencil printable overmold.

SD1010

100% solids liquid encapsulant designed for encapsulation & bonding applications requiring very high modulus & heat resistance. Thixotropic & well suited as a damming product for low viscosity encapsulants. Dimensional stability, low stress, rigid, durable, high Tg, & thermally curable. Designed to be used with NoSWEEPTM EW8000 series encapsulant.

1000 1/100 + 1/165 40 2000 85D N/A
SD1011

100% solids liquid encapsulant designed for encapsulation & bonding applications requiring very high modulus & heat resistance. Thixotropic & well suited as a damming product for low viscosity encapsulants. Dimensional stability, low stress, rigid, durable, high Tg, & thermally curable.

30 1/100 + 1/165 15 4000 85D N/A
SD8002

100% solids, liquid encapsulant designed for encapsulation & bonding applications requiring very high modulus & heat resistance. Thixotropic & well suited as a damming product for low viscosity encapsulants & other bonding uses requiring minimal flow during curing. Dimensional stability, low stress, & thermally curable.

200 1/100 + 1/165 15 3500 85D N/A