Products

EW7072 NoSWEEP™ Wire Bond Encapsulant

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Catalog No. Packaging Size Price Quantity
EW7072 30cc
€0.00

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Description

100% solid, silica filled liquid encapsulent for encapsulation of narrow diameter, long, & ultra fine pitch wire bonds on semiconductor devices. Thermally curable & non-sweeping. Available in dam & fill or glob top versions.

Tg:
180ºC
Viscosity:
150 kCps
Appearance:
Gray Paste

MSDS / Technical Data Sheets / Product Literature

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