Wire Bond
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EW8002 NoSWEEP™ Wire Bond EncapsulantCatalog Number EW8002-10Inquire for availability.Phone: 1(800)523-2575Email: [email protected]
100% solid, silica filled liquid encapsulant designed for quick self-leveling in large dam & fill or glob top applications, & encapsulation of narrow diameter, long, & ultra fine pitch wire bonds on semiconductor devices. Low modulus & CTE, excellent adhesion to inorganic & organic substrates, thermally curable, & non-sweeping. Available in dam & fill or glob top versions.