|Cat. #||Description||Viscosity (kCps)||Cure Time/ Temp (hrs/°C)||Tg (°C)||CTE (ppm)||Modulus (MPa)||Durometer||Thermal Conductivity (W/m•K)|
Structural epoxy adhesive with high strength & durability. Particularly useful for demanding bonding applications requiring very high performance properties. Tough, impact resistant, good adhesion to many metals, ceramics, & thermosetting plastics. Thermally curable.
|100||1/100 + 1/165||12||4000||85D||N/A|
100% solid, silica filled liquid encapsulant designed for quick self-leveling in large dam & fill or glob top applications, & encapsulation of narrow diameter, long, & ultra fine pitch wire bonds on semiconductor devices. Low modulus & CTE, excellent adhesion to inorganic & organic substrates, thermally curable, & non-sweeping. Available in dam & fill or glob top versions.
|50||1/100 + 1/165||15||3500||85D||N/A|
100% solids liquid encapsulant designed for encapsulation of very narrow diameter, long & ultra fine pitch wire bonds on semiconductor devices. Cured thermally at lower temperatures than other wire bonding products & thus suitable for use on temperature sensitive substrates. Available in dam & fill or glob top versions.
High performance epoxy for encapsulation applications. Well suited for many bonding & sealing uses requiring high modulus & high temperature resistance. Thermally curable.
|6||1/100 + 1/165||15||4000||90D||N/A|