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SD54G0 EdgeCONTROL™

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Catalog No. Packaging Size Price Quantity
SD54G0 30cc
€0.00

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Description

Low modulus retention dam specifically formulated to offer low cure stress & low warpage for liquid encapsulation of BGA & MCM packages. Good adhesion to various rigid and flexible organic & ceramic substrates, high viscosity, high thixotropy, & thermally curable. Designed to be used with LoSTRESSTM liquid encapsulant.

Molecular Weight:
<2000
Viscosity:
100
Hazards:
Skin sensitizer
Handling:
Gloves & chemical goggles

MSDS / Technical Data Sheets / Product Literature

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