General Component Assembly

General Component Assembly

Cat. # Description Viscosity (kCps) Cure Time/ Temp (hrs/°C) Tg (°C) CTE (ppm) Modulus (MPa) Durometer Thermal Conductivity (W/m•K)
PC800A&B 2 component acrylic adhesive with excellent adhesion to many metals, plastics, & composites. Designed for applications needing good fast setting bonds at room temperature. Room temperature curable. gel 4/RT 120 250 65D N/A
CC1002

Epoxy based coating & sealant with high heat resistance, chemical resistance, excellent adhesion & durability. Low viscosity, high gloss & curable by heat.

0.4 1/150 70 2500 85D N/A
CC1003

Epoxy based coating & sealant with high heat resistance, chemical resistance, excellent adhesion & durability. Low viscosity, high gloss & curable by heat.

0.6 1/150 70 2500 85D N/A
CC1004

Epoxy based coating & sealant with high heat resistance, chemical resistance, excellent adhesion & durability. Low viscosity, high gloss & curable by heat.

2 1/150 70 2500 85D N/A
PC550A&B

2 component, epoxy adhesive designed for bonding & sealing when high strength & toughness is required. Non-rigid, tough, & good adhesive properties to many substrates including metals, composites, ceramics, many plastics, & especially good for bonding fiberglass. Room temperature or thermal curing.

40 4/RT 120 100 70D N/A
PC520

Low temperature curable, structural epoxy adhesive with high strength & durability. Useful for demanding bonding applications requiring high performance properties. Good adhesion to many metals, ceramics, & thermosetting plastics.

200 0.5/150 50 1200 80D N/A
PC620A&B

2 component epoxy designed for bonding, encapsulating, & sealing applications requiring high strength, high rigidity, & high Tg. Thermally curable.

20 2/150 + 2/200 50 3550 90D N/A
HPA900 2 component polyurethane designed for bonding applications requiring adhesion to hard to bond surfaces. Excellent adhesion to many metals, plastics, & elastomers, & quick cure time at room temperature. 0.2 24/RT 200 0.5 85D N/A
PC600A&B

2 component epoxy designed for bonding, encapsulating, & sealing applications requiring high strength, high rigidity, & very high Tg. Rapid thermal curing.

0,2 1/100 + 1/150 + 1/200 60 1000 90D N/A
PC1200

2 component epoxy encapsulant for applications requiring high thermal conductivity, heat resistance, rigidity, & dimensional stability. Excellent adhesion to many substrates including metals, themosetting plastics, & ceramics, good durability, high modulus, low CTE, & thermally curable.

65 1/150 + 1/165 15 2500 90D 1.1
PC610K

2 component, epoxy product designed for applications requiring high absorption (low reflectivity) of infra red radiation. High heat resistance, high modulus, good dimensional stability, durabe, & thermally curable.

20 1/150 50 3200 85D N/A