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SD54G0 EdgeCONTROL™Catalog Number SD54G0-30
Low modulus retention dam specifically formulated to offer low cure stress & low warpage for liquid encapsulation of BGA & MCM packages. Good adhesion to various rigid and flexible organic & ceramic substrates, high viscosity, high thixotropy, & thermally curable. Designed to be used with LoSTRESSTM liquid encapsulant.
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SF5021 OptiCLEAR™ Liquid Encapsulant FillCatalog Number SF5021
Low modulus fill material specifically designed to offer efficient light transmission & low cure stress. A 100% solids, unfilled, liquid encapsulant designed for encasulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organice. UV or thermally curable.
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WL2000 Wafer Level CoatingCatalog Number WL2000Inquire for availability.Phone: (886) 2 8712 0600Email: [email protected]
Epoxy based protective &/or negative photoresist coating suited for applications at the wafer level. Excellent adhesion, good chemical resistance, low viscosity, high gloss, & UV &/or heat curable. Applied by brush, dip, spin coat, or spray methods.
UV Curable