Optical Encapsulants - OptiCLEAR™
OptiCLEAR™ Optical Encapsulants & Adhesives are specially formulated for use on optical sensors, digital cameras, light transmission devices and doming applications.
These transparent liquid encapsulants are 100% solids, odorless epoxies. They function well in thick or thin encapsulation with versions that cures via UV or thermal energy as well as at room temperature.
OptiCLEAR™ encapsulants & adhesives are excellent alternatives to acrylic encapsulants.
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PC570 Rapid Heat Curing Epoxy Adhesive/Encapsulant
$0.00Inquire for availability.
- Email: info@polysciences.com
- Phone: 1 (800) 523-2575
2 component epoxy designed for bonding, encapsulating, & sealing applications requiring high strength, high rigidity, & high Tg. Thermally curable.
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SF801 A&B OptiCLEAR™ Liquid Encapsulant Fill
$0.00Inquire for availability.
- Email: info@polysciences.com
- Phone: 1 (800) 523-2575
2 component epoxy designed for bonding, encapsulating, & sealing applications require good optical clarity. Curable at ambient temperatures or preferably with moderate heat, excellent adhesion to many substrates including metals, glass, & ceramics, low viscosity, & thermally curable.
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Silicone Gel Encapsulant HV100A&B
$0.00Inquire for availability.
- Email: info@polysciences.com
- Phone: 1 (800) 523-2575
2 component clear silicone gel suitable for various applications. Inert, low modulus, low viscosity, clear, & thermally curable.
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HV331 Silicone Gel Kit
$0.00Inquire for availability.
- Email: info@polysciences.com
- Phone: 1 (800) 523-2575
2 component, low viscosity silicone encapsulant suitable for encapsulation applications including sesnsitive optoelectronic assemblies. Stress free & thermally curable.
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SF503A OptiCLEAR™ Liquid Encapsulant Fill
$0.00Inquire for availability.
- Email: info@polysciences.com
- Phone: 1 (800) 523-2575
Liquid encapsulant fill material specifically designed to offer efficient light transmission & low cure stress. 100% solids, unfilled, liquid encapsulant designed for encapsulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organic. UV or thermally curable. Learn More -
PC200 A&B Potting Compound Epoxy
Starting at: $0.00
Inquire for availability.
- Email: info@polysciences.com
- Phone: 1 (800) 523-2575
A versatile, 2 part, fire resistant, room temperature curable epoxy. Useful as an adhesive, encapsulant or potting compound.
Volume pricing available, please call (800) 523-2575 for information.
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PC7050 UV Curable Epoxya
Starting at: $0.00
Inquire for availability.
- Email: info@polysciences.com
- Phone: 1 (800) 523-2575
UV curable epoxy product well suited for use in applications requiring high heat resistance, rigidity, & durability. Low viscosity, good adhesion, high modulus, high strength, & rapid cure.
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SF5021 OptiCLEAR™ Liquid Encapsulant Fill
Starting at: $0.00
Inquire for availability.
- Email: info@polysciences.com
- Phone: 1 (800) 523-2575
Low modulus fill material specifically designed to offer efficient light transmission & low cure stress. A 100% solids, unfilled, liquid encapsulant designed for encasulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organice. UV or thermally curable.
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SF850 A&B OptiCLEAR™ Liquid Encapsulant Fill
Starting at: $157.50
2 component epoxy designed for encapsulating & coating applications requiring good clarity & high heat resistance. Excellent adhesion to many substrates including metals, glass, & ceramics.
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