Optical Encapsulants - OptiCLEAR™

OptiCLEAR™ Optical Encapsulants & Adhesives are specially formulated for use on optical sensors, digital cameras, light transmission devices and doming applications.

These transparent liquid encapsulants are 100% solids, odorless epoxies. They function well in thick or thin encapsulation with versions that cures via UV or thermal energy as well as at room temperature.

OptiCLEAR™ encapsulants & adhesives are excellent alternatives to acrylic encapsulants.

9 Item(s)

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  1. PC570 Rapid Heat Curing Epoxy Adhesive/Encapsulant

    PC570 Rapid Heat Curing Epoxy Adhesive/Encapsulant

    $0.00

    Inquire for availability.

    2 component epoxy designed for bonding, encapsulating, & sealing applications requiring high strength, high rigidity, & high Tg. Thermally curable.

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  2. SF801 A&B OptiCLEAR™ Liquid Encapsulant Fill

    SF801 A&B OptiCLEAR™ Liquid Encapsulant Fill

    $0.00

    Inquire for availability.

    2 component epoxy designed for bonding, encapsulating, & sealing applications require good optical clarity. Curable at ambient temperatures or preferably with moderate heat, excellent adhesion to many substrates including metals, glass, & ceramics, low viscosity, & thermally curable.

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  3. Silicone Gel Encapsulant HV100A&B

    Silicone Gel Encapsulant HV100A&B

    $0.00

    Inquire for availability.

    2 component clear silicone gel suitable for various applications. Inert, low modulus, low viscosity, clear, & thermally curable.

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  4. HV331 Silicone Gel Kit

    HV331 Silicone Gel Kit

    $0.00

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    2 component, low viscosity silicone encapsulant suitable for encapsulation applications including sesnsitive optoelectronic assemblies. Stress free & thermally curable.

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  5. SF503A OptiCLEAR™ Liquid Encapsulant Fill

    SF503A OptiCLEAR™ Liquid Encapsulant Fill

    $0.00

    Inquire for availability.

    Liquid encapsulant fill material specifically designed to offer efficient light transmission & low cure stress. 100% solids, unfilled, liquid encapsulant designed for encapsulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organic. UV or thermally curable. Learn More
  6. PC200 A&B Potting Compound Epoxy

    PC200 A&B Potting Compound Epoxy

    Starting at: $0.00

    Inquire for availability.

    A versatile, 2 part, fire resistant, room temperature curable epoxy. Useful as an adhesive, encapsulant or potting compound.

    Volume pricing available, please call (800) 523-2575 for information.

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  7. PC7050 UV Curable Epoxya

    PC7050 UV Curable Epoxya

    Starting at: $0.00

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    UV curable epoxy product well suited for use in applications requiring high heat resistance, rigidity, & durability. Low viscosity, good adhesion, high modulus, high strength, & rapid cure.

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  8. SF5021 OptiCLEAR™ Liquid Encapsulant Fill

    SF5021 OptiCLEAR™ Liquid Encapsulant Fill

    Starting at: $0.00

    Inquire for availability.

    Low modulus fill material specifically designed to offer efficient light transmission & low cure stress. A 100% solids, unfilled, liquid encapsulant designed for encasulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organice. UV or thermally curable.

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  9. SF850 A&B OptiCLEAR™ Liquid Encapsulant Fill

    SF850 A&B OptiCLEAR™ Liquid Encapsulant Fill

    Starting at: $157.50

    2 component epoxy designed for encapsulating & coating applications requiring good clarity & high heat resistance. Excellent adhesion to many substrates including metals, glass, & ceramics.

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