Thermally Conductive

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  1. PC1200 Epoxy Adhesive Kit

    PC1200 Epoxy Adhesive Kit

    $0.00

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    2 component epoxy encapsulant for applications requiring high thermal conductivity, heat resistance, rigidity, & dimensional stability. Excellent adhesion to many substrates including metals, themosetting plastics, & ceramics, good durability, high modulus, low CTE, & thermally curable.

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  2. PC410 A&B Potting Compound Liquid Encapsulant

    PC410 A&B Potting Compound Liquid Encapsulant

    $0.00

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    2 component, highly filled epoxy resin encapsulant designed for potting & encapsulation where high thermal conductivity is required. Excellent moisture resistance, low CTE, high strength, & room temperature or thermally curable.

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  3. PC420 A&B Thermally Conductive Epoxy

    PC420 A&B Thermally Conductive Epoxy

    $0.00

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    2 component, ceramic, non-metal filled, epoxy-based product designed for potting & encapsulation where high strength & thermal conductivity are required, particularly useful for the assembly of components requiring heat dissipation. Curable at room temperature or by heat.

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  4. Liquid Encapsulant HV300A&B

    Liquid Encapsulant HV300A&B

    $0.00

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    2 component, silicone encapsulant designed for applications requiring high thermal conductivity & stability. Rapidly cures with moderate heat & easy to use.

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