SF850 A&B OptiCLEAR™ Liquid Encapsulant Fill
In stock
2 component epoxy designed for encapsulating & coating applications requiring good clarity & high heat resistance. Excellent adhesion to many substrates including metals, glass, & ceramics.
Application(s):
Glob Top, Fill, Potting Compound
Shipping Requirements:
None
Tg:
150º C
Viscosity:
0.5
Appearance:
Clear colorless
Cure Type:
Thermal
CTE (ppm):
60
Modulus (MPa):
500
Durometer:
80D
Thermal Conductivity (W/m•K):
N/A
Polymer Type:
Epoxy
Cure Time/ Temp (hrs/°C):
01.05.0150
Glass Transition Temperature, Tg (ºC):
150